<div class="detailmodule_html"><div class="detail-desc-decorate-richtext"><p>Features:<br/>1.Multi-functional conversion: support 25 kinds of SMD package chip conversion to DIP8, to meet a variety of needs<br/>2.Wide compatibility: compatible with XGecu T48/T56 and other programmers, wide range of applications<br/>3.High-quality materials: 4-layer PCB boards made of high-quality materials to ensure stability and durability<br/>4.Optimized circuit design: The circuit is carefully optimized to minimize interference, suitable for SPI FLASH high-speed programming<br/>5.Easy to assemble and use: DIP8 interface position design is reasonable, to avoid conflict, simplify the installation steps</p><p>Parameter:<br/>Product name: 25 in 1 multi-function board<br/>Size: 61x50x2mm<br/>Function: Chip burning, read and write chips. Support to convert 25 kinds of SMD package chips to DIP8 package</p><p>Support to convert the following package chips to DIP8 package:<br/>1: SOC8-150MIL(mark 5*4)<br/>2: SOP8-200MIL(mark 5.3*5.3)<br/>3: DFN8-8*6<br/>4: DFN6-1.2*1.2<br/>5: USON8-1.5*1.5<br/>6: DFN8 -2*2<br/>7: DFN8 -3*2<br/>8: USON8-3*2<br/>9: SOT6-23-6<br/>10: SOT5-23-5<br/>11: USON8-4*3<br/>12: WSON8-6*5<br/>13: WSON8-3*3<br/>14: WLCSP-16<br/>15: WLCSP-12<br/>16: WLCSP-21<br/>17: WLCSP12--3119<br/>18: WLCSP12--2320<br/>19: WLCSP8-2216<br/>20: TSSOP8<br/>21: MSOP8<br/>22: XSON8-4<br/>23: BGA24-5*5<br/>24: BGA24-4*6<br/>25: SOIC16 300MIL</p><p>Note: This adapter is designed for SPI NOR Flash and may not be suitable for SPI NAND.</p><p>Package include:<br/>PCB x1<br/>Pin x1<br/><br/></p></div></div><p><br/></p>